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Innocomm Mobile Technology
Products
Connectivity Module
BM10 (BLE module)
Single module 2.4G Bluetooth Low Energy module
Connectivity Module
Key Features
Specifications
  • ARM Cortex M3 with sensor engine and embedded flash
  • Ultra-low power RF
  • Up to date certificated BLE software stack
Specification
IC
  • TI CC2640
Form Factor
  • 25.45 mm × 16.70 mm × 2.20 mm
  • LGA 40pin Package
Memory
  • 128KB Flash
  • 20KB SRAM+8KB SRAM for Cache
Physical Interface
  • GPIO x 31
  • SPI x 2
  • I2C x 1
  • I2S x 1
Power Supply
  • 1.9 - 3.8V
Software
  • TI-RTOS
  • BLE Protocol Stack
  • Sample Applications
Mounting Method
  • SMT
Enviroment
  • Operation  temperature:-40 to 85
Certification
  • CE
  • FCC
  • Canada IC
  • Japan MIC 
  • Taiwan NCC