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Innocomm Mobile Technology
Products
Connectivity Module
BM05 (BLE module)
Single module 2.4G Bluetooth Low Energy module
Connectivity Module
Key Features
Specifications
  1. Integard enchanced MCU to save cost
  2. Ultra low power consumption performance
  3. Up to date certificated BLE software stack
Specification
IC
  • TI CC2541
  • Plus enhanced MCU 8051
Form Factor
  • 13.0 x 10.5 x 1.9 mm
  • 18.5 x 10.5 x 1.9 mm (embedded atenna)
Memory
  • 256KB Flash with 8KB RAM
Physical Interface
  • GPIO x 20
  • I2C x1
Power Supply
  • 2.0 - 3.6V
BLE Stack
  • GAT
  • ATT
  • GATT
  • SMP
  • L2CAP
Mounting Method
  • SMT
Enviroment
  • Operation  temperature:-40 to 85
Cerification
  • CE
  • FCC